In 2020, Cheng and his colleagues presented a paper entitled Al/Al2O3 direct bonding using transient eutectic liquid phase. In this research, they stated that ceramic base layers used in applications such as integrated circuit boards and diodes with high light emission. Directly bonded copper (DBC) layer is a ceramic layer that is widely used in electronic circuit boards for semiconductor modules, but the formation of CU2O at the interface causes a large deposition pressure. Therefore, the DBC layer has little strength against thermal cycling. Direct bonded aluminum (DBA), which uses aluminum as the metal circuit, used for ceramic layers. Although this combination not formed at the interface of ceramic and metal, but the bonded sample has good strength against thermal cycle. Khazaka et al. showed that in the work environment with thermal cycling, the DBA layer achieves better performance compared to the DBC layer. During thermal cycling tests from 55 to 250°C after 1500 cycles, no delamination of aluminum from the ceramic base metal plate observed. For conventional DBC technology, cracking or delamination occurs in DBC after 20 to 30 cycles. This improvement is due to the different plastic hardening behavior between aluminum and copper. To increase aluminum-ceramic bonding, the annealing temperature increased above the melting point of aluminum rather than the soaking effect. Increase and decrease the contact angle between aluminum and ceramic.